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Memory Modules

Witek Stacked SDRAM Registered DIMM is built with patented proprietary technology to accommodate extended density on a single DIMM slot space. By adopting this technology, Witek is able to build SDRAM DIMM with capacity up to 1GB. Meanwhile, this is a very cost-effective way to build high-density module which uses the mainstream 128Mbit/256Mbit/512Mbit SDRAM instead of using the two rows double sides in one.

Our proprietary design consists of the following features:


 

168pin

 

 

 

 

 

 

 

144pin
 

 

 

 
 

FEATURES

  • Equal Trace Length
    Data traces are precisely designed to ensure each data signal runs through the same distance for high frequency operation. The data paths run through the gold pins underneath and reach each SDRAM on both the mother and the stacked board with same distance and same impedance at the same time.
  • Stacked Board Test Fixture
    A test fixture is designed for a full functional test on each mother and stacked board separately before they are assembled together. This is to ensure minimum rework effort on the module at the final stage so that quality and workmanship would be guaranteed.
  • Heat Dispersion Layer
    There is a 0.3-0.5mm gap designed between PCB (7H9RC) and PCB (7H9Rcad) of the SDRAM for heat dispersion. This guarantees the SDRAM is able to maximize its performance under the normal working temperature within the specification.
 
 



  1.Desk Top 168pin DIMM Module
Configuration
Module Board
Item No.
Bit
IC Description
Bank
Side
Remarks
64/128MB
7H8RC
8/16M*64\72
8\9*(8/16M*8)
1
Single
WITH ECC

128/256MB
7H8RC
16/32M*64\72
16/18*(8/16M*18)
2
Double
WITH ECC
128/256/512MB
7H9RC
16/32M*64\72
16\18*(16/32/64M*4)
1
Double
WITH ECC
256/512/1G
7H9Rcad
32/64M/1G*64\72
32\36*(16/32/64M*4)
2
Double
PCB Stack with ECC
256MB/512MB/1G
7H9RC1
32/64M/1G*64\72
32\36*(16/32/64M*4)
2
Double
WITH ECC
256MB/512MB/1G
7H9RCX
32/64M/1G*64\72
32\36*(16/32/64M*4)
2
Double
IC Stack with ECC
7H Series--Refer to WITH BUFFER (REGISTERED & PLL) SYNCHRONOUS DRAM 3.3V WITH  EEPROM
 7H8RC have (Buffer No. 16 series 334+334,334+836,835+835 & inventor) 3 items
 7H9RCX and 7H9RC use (835+835 & inventor)

 PCB Stacked Dimension

 Height: 39.33±0.15mm
 Length: 133.22±0.15mm
 Thickness: 7±0.2mm

 
 
2.Desk Top 168pin DIMM Module
Configuration
Module Board
Item No.
Bit
IC Description
Bank
Side
Remarks
32/64/128MB


7F7R-1/1E
4/8/16M*64
4*(4/8/16M*16)
1
Single
Without ECC
64/128/256MB
7F7R-B/E
8/16/32M*64
8*(4/8/16M*16)
2
Single
Without ECC
64/128/256MB
7F8R-A1
8/16/32M*64
8*(8/16/32M*8)
1
Single
Without ECC
64/128/256MB
7F8R-A1E
8/16/32M*64
8*(8/16/32M*8)
1
Single
Without ECC
64/128/256MB
7F8R-B/E
8/16/32M*64
8*(8/16/32M*8)
1
Single
Without ECC
128/256/512MB
7F8R-B/E
16/32/64M*64
8*(8/16/32M*8)
2
Double
Without ECC
64/128/256MB
7F8R-C
8/16/32M*64/72
8/9*(8/16M*8)
1
Single
With ECC
128/256/512MB
7F8R-C
16/32/64M*64/72
8/9*(8/16/32M*8)
2
Double
With ECC
128/256/512MB
7F9R-C/E
16/32/64M*64/72
16/18*(16/32/64M*4)
1
Double
With ECC
256/512MB/1GB
7F9R-cad
32/64/128M*64/72
32/36*(16/32/64M*4)
2
Double
With ECC
 
7F Series--Refer to UNBUFFER SYNCHRONOUS DRAM 3.3V WITH EEPROM
 
3.Notebook 144pin SO-DIMM Module
Configuration
Module Board
Item No.
Bit
IC Description
Bank
Side
Remarks

32/64/128MB

7G4R
4/8/16M*64
4*(4/8/16M*16)
1
Single
With Network Register
64/128/256MB
7G4R
8/16/32M*64
8*(4/8/16M*16)
2
Double
With Network Register
64/128/256MB
7G5R
8/16/32M*64
8*(8/16/32M*8)
1
Double
With Network Register
7G Series--Refer to UNBUFFER SYNCHRONOUS DRAM 3.3V with EEPROM



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